The hottest semiconductor market today is the automotive market, the pace of the "new four" cars is getting faster and faster, and more and more chips are needed, the most notable of which is the MCU, the "lack of core" of the big account. Since 2020, MCU has been the protagonist of the "lack of core", but to date, after the major manufacturers continue to actively expand production, has the lack of core situation been alleviated?
Automotive MCU chips How long will there be a "shortage"?
The hottest semiconductor market today is the automotive market, the pace of the "new four" cars is getting faster and faster,
and more and more chips are needed, the most notable of which is the MCU, the "lack of core" of the big account. Since 2020,
MCU has been the protagonist of the "lack of core", but to date, after the major manufacturers continue to actively expand production,
has the lack of core situation been alleviated?
At present, the shortage of cores for automotive-grade MCUs has improved, from an overall shortage in the past two years to a structural shortage.
The higher the number of bits, the higher the performance, and the higher the R&D difficulty and unit price. Among them,
8-bit MCU performance can meet the needs of most scenarios and is widely used for basic functions, such as fan, wiper, sunroof, seat control and so on.
The 32-bit MCU is used in high-end fields such as automotive intelligent cockpit, body control, assisted driving and driving safety system.
Benefiting from the characteristics of small size and excellent performance, as well as the trend of automotive intelligence, currently,
the global MCU chip products are mainly 32-bit. According to the McClean report, in 2021, more than three-quarters of automotive MCU sales will come from 32-bit MCUs,
and with the further development of automotive intelligence and electrification, the proportion of 32-bit MCU chips is expected to further increase.
Yao Di, vice president of Naxin Microelectronics, told reporters, "This structural shortage mainly comes from the rapid growth of demand for specific chips in the new energy vehicle and pan-energy industries, and in the short term,
the capacity expansion of automotive chips at specific process nodes cannot catch up with the growth rate of demand.
From the perspective of the entire semiconductor industry chain, packaging and testing capacity has been fully relieved.
At the same time, the wafer capacity demand has also been divided, such as automotive chips used in the low-voltage process wafer capacity supply shortage has been fully alleviated,
the use of high-voltage BCD process and power device process wafer capacity is still relatively short. Therefore, this structural shortage phenomenon will continue for some time."